Fabrication of Vacuum-Sealed Capacitive Micromachined Ultrasonic Transducer Arrays Using Glass Reflow Process
نویسندگان
چکیده
Nguyen Van Toan 1,*, Shim Hahng 2,3, Yunheub Song 2 and Takahito Ono 3 1 Microsystem Integration Center (μSIC), Tohoku University, Sendai 980-8579, Japan 2 Department of Electronic Engineering, Hanyang University, Seoul 04763, Korea; [email protected] 3 Graduate School of Engineering, Tohoku University, Sendai 980-8579, Japan; [email protected] (S.H.); [email protected] (T.O.) * Correspondence: [email protected]; Tel.: +81-22-795-5806
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ورودعنوان ژورنال:
- Micromachines
دوره 7 شماره
صفحات -
تاریخ انتشار 2016